Development of Millimeter-Wave Planar Antennas Using Low-Loss Materials

被引:0
|
作者
Ito, Naoki [1 ]
Mase, Atsushi [1 ]
Kogi, Yuichiro [2 ]
Seko, Noriaki [3 ]
Tamada, Masao [3 ]
Shimazu, Hiroshi [4 ]
Sakata, Eiji [4 ]
机构
[1] Kyushu Univ, Art Sci & Technol Ctr Cooperat Res, Fukuoka 8168580, Japan
[2] Fukuoka Inst Technol, Fac Engn, Fukuoka 8110295, Japan
[3] Japan Atom Energy Agcy, Quantum Beam Sci Directorate, Takasaki, Gunma 3701292, Japan
[4] Kyushu Hitachi Maxell Ltd, Fukuoka 8221296, Japan
关键词
SURFACE MODIFICATION; DELAY SPREAD; PLASMA; ADHESION; SYSTEM; COPPER;
D O I
10.1143/JJAP.49.106506
中图分类号
O59 [应用物理学];
学科分类号
摘要
As the importance of advanced millimeter-wave diagnostics increases, the fabrication of high-performance devices and components becomes essential. In this paper, we describe the development of millimeter-wave planar antennas using low-loss fluorine substrates. The problems to be solved in this study are the low degree of adhesion between copper foil and the fluorine substrate and the accuracy of device pattern using conventional fabrication techniques. In order to solve these problems, a new surface treatment of fluorine films and a fabrication method using electro-fine-forming (EF2) are proposed. In order to confirm the performance of the treated films, microstrip lines (MSLs) and planar patch antennas with a low sidelobe level in the E-plane are designed and fabricated on conventional fluorine substrates and grafted poly(tetrafluoroethylene) (PTFE) films. (C) 2010 The Japan Society of Applied Physics
引用
收藏
页码:1065061 / 1065065
页数:5
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