共 5 条
- [2] Modelling and prediction on process dependent wafer warpage for FOWLP technology using finite element analysis and statistical approach 2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2020, : 386 - 393
- [5] Failure modelling of trabecular bone using a non-linear combined damage and fracture voxel finite element approach Biomechanics and Modeling in Mechanobiology, 2013, 12 : 225 - 241