Three-dimensional hybrid circuits: the future of neuromorphic computing hardware

被引：0
|
作者：
Lin, Peng [1 ]
Xia, Qiangfei [2 ]
机构：
[1] Zhejiang Univ, Coll Comp Sci & Technol, Hangzhou 310027, Zhejiang, Peoples R China
[2] Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA
来源：
NANO EXPRESS | 2021年 / 2卷 / 03期
关键词：
neuromorphic computing; three-dimensional circuits; emerging devices; INTEGRATION; STORAGE; DESIGN;
D O I：
10.1088/2632-959X/ac280e
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Recently there have been intensive research efforts to adopt emerging electronic devices for neuromorphic computing. However, the usage of these devices and arrays mainly was to implement parallel matrix multiplication in the two-dimensional (2D) space. This Perspective discusses the importance and implementation of three-dimensional (3D) hybrid circuits for neuromorphic computing, focusing on the integration density, data communication, and functional connectivity. We believe that 3D neuromorphic systems represent the future of artificial intelligence hardware with much-improved power efficiency and cognitive capabilities.
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页数：3
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