Factors affecting the calculation of effective conductivity in printed circuit boards

被引：25

作者：

Culham, JR ^{[1
]}

Yovanovich, MM ^{[1
]}

机构：

[1] Univ Waterloo, Dept Mech Engn, Microelect Heat Transfer Lab, Waterloo, ON N2L 3G1, Canada

来源：

ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS | 1998年

关键词：

D O I：

10.1109/ITHERM.1998.689603

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

A comparative study is presented that demonstrates the importance of including both the material resistance and the spreading resistance in the calculation of effective conductivity for printed circuit board applications. An analytically based Fourier series model is used to calculate effective conductivity in three dimensional test coupons. Results show that models based exclusively on cross-plane and in-plane resistive networks are not adequate for predicting effective conductivity in multilayer, laminated printed circuit boards. The mixed boundary conditions found in most microelectronic applications accentuate the importance of spreading: resistance between heat sources and the convective boundaries. Discrepancies between commonly used methods of calculating effective conductivity;Ind methods incorporating both the bulk material and spreading resistance can be greater than 100% for geometries typically found in microelectronics applications.

引用

页码：460 / 467

页数：8

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