Thermal Expansion Behaviour of SiCp Reinforced Copper Matrix Composites by Hot Pressing

被引：0
|
作者：
Wang, Changchun [1 ]
Min, Guanghui [2 ]
Kang, Suk-Bong [3 ]
机构：
[1] Linyi Normal Univ, Dept Phys, Linyi 276005, Peoples R China
[2] Shandong Univ, Sch Mat Sci & Engn, Jinan 250061, Peoples R China
[3] Korea Inst Mat Sci, Chang Won 641010, South Korea
来源：
METALLOFIZIKA I NOVEISHIE TEKHNOLOGII | 2009年 / 31卷 / 09期
关键词：
SiCp/Cu composite; electroless copper plating; coefficient of thermal expansion; FABRICATION;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Cu-coated SiC powder was fabricated by electroless copper plating process. SiCp reinforced copper matrix composites with the reinforcement content of 30-50 vol.% were fabricated by hot pressing using the coated and uncoated powder. Microstructure and thermal expansion behaviour of the composites were studied. The results showed that, with the increase of temperature and SiCp particle size, the CTE of the composites increased. CTE of the composites can be reduced by the copper coating layer and annealing treatment. Important data for the application of SiCp/Cu composites as electronic packaging materials are provided.
引用
收藏
页码：1249 / 1255
页数：7
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