Compliant effect of low-temperature Si buffer for SiGe growth

被引:37
|
作者
Luo, YH [1 ]
Wan, J [1 ]
Forrest, RL [1 ]
Liu, JL [1 ]
Jin, G [1 ]
Goorsky, MS [1 ]
Wang, KL [1 ]
机构
[1] Univ Calif Los Angeles, Dept Elect Engn, Device Res Lab, Los Angeles, CA 90095 USA
关键词
D O I
10.1063/1.1337633
中图分类号
O59 [应用物理学];
学科分类号
摘要
Relaxed SiGe attracted much interest due to the applications for strained Si/SiGe high electron mobility transistor, metal-oxide-semiconductor field-effect transistor, heterojunction bipolar transistor, and other devices. High-quality relaxed SiGe templates, especially those with a low threading dislocation density and smooth surface, are critical for device performance. In this work, SiGe films on low-temperature Si buffer layers were grown by solid-source molecular-beam epitaxy and characterized by atomic force microscope, double-axis x-ray diffraction, and photoluminescence spectroscopy. It was demonstrated that, with the proper growth temperature and Si buffer thickness, the low-temperature Si buffer became tensily strained and reduced the lattice mismatch between the SiGe and the Si buffer layer. This performance is similar to that of the compliant substrate: a thin substrate that shares the mismatch strain in heteroepitaxy. Due to the smaller mismatch, misfit dislocation and threading dislocation densities were lower. (C) 2001 American Institute of Physics.
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收藏
页码:454 / 456
页数:3
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