Gallium nitride power HEMT for high switching frequency power electronics

被引:26
|
作者
Omura, Ichiro [1 ]
Saito, Wataru [1 ]
Domon, Tomokazu [2 ]
Tsuda, Kunio [3 ]
机构
[1] Toshiba Co Ltd, Semiconductor Company, Kawasaki, Kanagawa 2128583, Japan
[2] Toshiba Business & Life Service Co, 212-8583 Kawasaki, Kanagawa, Japan
[3] Toshiba Res & Dev Ctr, 212-8583 Kawasaki, Kanagawa, Japan
关键词
gallium nitride; HEMT; power MOSFET; IGBT;
D O I
10.1109/IWPSD.2007.4472634
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Very large number of power semiconductor devices (semiconductor power switches) are used in power electronics systems such as AC-DC converter for PCs, DC-DC converters for CPU, motor driver systems and induction heating systems for home appliances, and GaN device is one of a promising candidate for future power devices thanks to the wide band gap semiconductor material property. In GaN base device research, the GaN-HEMT structure is widely investigated than the other device structures specially in RF technology field. This structure also suits to high switching frequency power electronics applications because of the high breakdown voltage and the inherent high speed characteristics of HEMT device. This paper describes the possibility of GaN-HEMT for power electronics applications specially focused on high switching frequency applications comparing the limit of silicon devices such as MOSFETs and IGBTs, and also describes latest research result including demonstration of high switching frequency power electronics circuit.
引用
收藏
页码:781 / +
页数:3
相关论文
共 50 条
  • [1] A survey of Gallium Nitride HEMT for RF and high power applications
    Fletcher, A. S. Augustine
    Nirmal, D.
    [J]. SUPERLATTICES AND MICROSTRUCTURES, 2017, 109 : 519 - 537
  • [2] Applications of Gallium Nitride in Power Electronics
    Scott, Mark J.
    Li, Jinzhu
    Wang, Jin
    [J]. 2013 IEEE POWER AND ENERGY CONFERENCE AT ILLINOIS (PECI), 2013, : 1 - 7
  • [3] Characterization and Modeling of a Gallium Nitride Power HEMT
    Peng, Kang
    Santi, Enrico
    [J]. 2014 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2014, : 113 - 120
  • [4] Characterization and Modeling of a Gallium Nitride Power HEMT
    Peng, Kang
    Eskandari, Soheila
    Santi, Enrico
    [J]. IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2016, 52 (06) : 4965 - 4975
  • [5] High power and linearity performances of gallium nitride HEMT devices on sapphire substrate
    Werquin, M
    Gaquiére, C
    Guhel, Y
    Vellas, N
    Theron, D
    Boudart, B
    Hoel, V
    Germain, M
    De Jaeger, JC
    Delage, S
    [J]. ELECTRONICS LETTERS, 2005, 41 (01) : 46 - 47
  • [6] Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics
    Won, Yoonjin
    Cho, Jungwan
    Agonafer, Damena
    Asheghi, Mehdi
    Goodson, Kenneth E.
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (06): : 737 - 744
  • [7] Physics and technology of gallium nitride materials for power electronics
    Roccaforte, Fabrizio
    Fiorenza, Patrick
    Lo Nigro, Raffaella
    Giannazzo, Filippo
    Greco, Giuseppe
    [J]. RIVISTA DEL NUOVO CIMENTO, 2018, 41 (12): : 625 - 681
  • [8] Physics and technology of gallium nitride materials for power electronics
    Fabrizio Roccaforte
    Patrick Fiorenza
    Raffaella Lo Nigro
    Filippo Giannazzo
    Giuseppe Greco
    [J]. La Rivista del Nuovo Cimento, 2018, 41 : 625 - 681
  • [9] Graphene integration with nitride semiconductors for high power and high frequency electronics
    Giannazzo, F.
    Fisichella, G.
    Greco, G.
    La Magna, A.
    Roccaforte, F.
    Pecz, B.
    Yakimova, R.
    Dagher, R.
    Michon, A.
    Cordier, Y.
    [J]. PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2017, 214 (04):
  • [10] New developments in gallium nitride and the impact on power electronics
    Khan, MA
    Simin, G
    Pytel, SG
    Monti, A
    Santi, E
    Hudgins, JL
    [J]. 2005 IEEE 36TH POWER ELECTRONIC SPECIALISTS CONFERENCE (PESC), VOLS 1-3, 2005, : 15 - 26