Thermal Conditions for Portable Military Electronic Equipment

被引:0
|
作者
Wilcoxon, Ross [1 ]
机构
[1] Rockwell Collins, Cedar Rapids, IA 52498 USA
关键词
Portable Electronics; Transient Thermal Testing;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Soldiers and Marines rely on electronics for communication, navigation and situational awareness. Increasing these capabilities, such as with longer range and higher bandwidth communication, generally comes at a price of greater power consumption and a corresponding increase in system power dissipation/thermal load. This increased power dissipation can limit the functional capabilities of systems when used in thermally challenging environments. One of these thermally challenging environments is inside the packs used by dismounted troops. This paper presents the results of testing to quantify the thermal resistance associated with operating electronics within packs that are typical of those that may be used by soldiers and Marines. Thermal mock-up systems were tested in two types of backpacks under various conditions. Steady state and transient temperature test results are compared to predictions generated with a spreadsheet-based analysis.
引用
收藏
页码:133 / 138
页数:6
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