Challenges in Evaluating Thickness, Phase, and Strain in Semiconductor Devices Using High-Resolution Transmission Electron Microscopy

被引：0
|
作者：
Rai, Raghaw [1 ]
Conner, James [1 ]
Murphy, Sharon [1 ]
Subramanian, Swaminathan [1 ]
机构：
[1] Austin Silicon Technol Solut, Austin, TX 78721 USA
来源：
ISTFA 2006 | 2006年
关键词：
D O I：
暂无
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：343 / 350
页数：8
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