Advances in High Power Laser Diode Packaging

被引：1

作者：

Wolak, Ed ^{[1
]}

Mitchell, Cameron ^{[1
]}

Crum, Trevor ^{[1
]}

Romero, Oscar ^{[1
]}

Gloyd, John ^{[1
]}

Liu, Daming ^{[1
]}

Cutillas, Serge ^{[1
]}

Park, Sang-Ki ^{[1
]}

Johnson, Kelly ^{[1
]}

Jin, Xu ^{[1
]}

Li, Hanxuan ^{[1
]}

Towe, Terry ^{[1
]}

Chyr, Irving ^{[1
]}

Miller, Robert ^{[1
]}

Meissner, Arne ^{[1
]}

Lenarduzzi, Dino ^{[1
]}

Harrison, James ^{[1
]}

机构：

[1] Spectra Phys Lasers, Tucson, AZ 85706 USA

来源：

PHOTONICS PACKAGING, INTEGRATION, AND INTERCONNECTS IX | 2009年 / 7221卷

关键词：

diode lasers; laser chip; laser bar; fiber; power conversion efficiency; high power; reliability;

D O I：

10.1117/12.810549

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

High-power, packaged diode-laser sources continue to evolve through co-engineering of epitaxial design, beam conditioning and thermal management. Here we review examples of improvements made to key attributes including reliable power, brightness, power per unit volume and value.

引用

页数：9

共 50 条

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