Magnetic and electrical transport properties of electrodeposited Ni-Cu alloys and Ni81Cu19/Cu multilayers

被引：42

作者：

Bakonyi, I ^{[1
]}

Tóth-Kádár, E ^{[1
]}

Tóth, J ^{[1
]}

Becsei, T ^{[1
]}

Tarnóczi, T ^{[1
]}

Kamasa, P ^{[1
]}

机构：

[1] Hungarian Acad Sci, Res Inst Solid State Phys & Opt, H-1525 Budapest, Hungary

来源：

JOURNAL OF PHYSICS-CONDENSED MATTER | 1999年 / 11卷 / 04期

关键词：

D O I：

10.1088/0953-8984/11/4/004

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

Electrodeposited Ni-Cu alloys and nanoscale Ni-Cu/Cu multilayers were produced by direct-current plating and pulse-plating. respectively The room-temperature electrical resistivity and thermopower as well as the Curie temperature for the Ni-Cu electrodeposits were in good agreement with relevant data reported for metallurgically processed Ni-Cu alloys. The same parameters were investigated also for the Ni81Cu19/Cu multilayers as a function of the constituent magnetic and non-magnetic layer thicknesses. The electrical resistivity of the multilayers was much larger than calculated for a parallel resistance model and their thermopower was more negative than expected on the basis of a volume average model, by using bulk values of both parameters for the sublayer materials. These differences were ascribed to surface scattering processes which can be significant in nanoscale multilayer structures.

引用

页码：963 / 973

页数：11

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