共 50 条
- [2] The Optimization of Hollow Hybrid Fin Heat Sinks under Impinging Airflows [J]. 2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 413 - 416
- [4] Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions [J]. ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, : 96 - 103
- [5] Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (01): : 47 - 54
- [6] Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks - Influence of flow bypass [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (02): : 142 - 149
- [7] Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks - influence of flow bypass [J]. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2000, 1 : 185 - 192
- [8] Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks - Influence of flow bypass [J]. ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS, 2000, : 185 - 192
- [9] Thermal design optimization for strip-fin heat sinks with a ducted air flow [J]. 2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2, 2006, : 297 - +