Assembly and interconnection technologies for electrical and optical microsystems

被引：0
|
作者：
MullerFiedler, R [1 ]
Dutzi, J [1 ]
Moss, E [1 ]
Kuttner, K [1 ]
Kummer, N [1 ]
Gundlach, M [1 ]
机构：
[1] ROBERT BOSCH GMBH,ZENTRALBEREICH FORSCH & VORAUSENTWICKLUNG,DEPT FV,FLD,D-70049 STUTTGART,GERMANY
来源：
MICRO-OPTICAL TECHNOLOGIES FOR MEASUREMENT, SENSORS, AND MICROSYSTEMS | 1996年 / 2783卷
关键词：
assembly technology; interconnection technology; silicon micromachining; thin-film-multilayer-technology; integrated optics; microoptics; integration technologies; microsystem;
D O I：
暂无
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
引用
收藏
页码：88 / 97
页数：10
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