An engineering model for moisture degradation of polymer/metal interfacial fracture toughness

被引：0
|
作者：
Ferguson, TP [1 ]
Qu, JM [1 ]
机构：
[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
来源：
2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces | 2005年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.
引用
收藏
页码：298 / 301
页数：4
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