Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

被引：31

作者：

Hu, Jing ^{[1
]}

Luo, Tingbi ^{[1
]}

Hu, Anmin ^{[1
]}

Li, Ming ^{[1
]}

Mao, Dali ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai 200240, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2011年 / 40卷 / 07期

基金：

中国国家自然科学基金;

关键词：

Lead-free solder; corrosion resistance; aging; LEAD-FREE SOLDER; INTERFACIAL REACTIONS; SMALL ADDITIONS; EUTECTIC ALLOY; SN-AG; ZINC; SUBSTRATE; JOINTS; CU; METALLIZATION;

D O I：

10.1007/s11664-011-1650-9

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Electrochemical corrosion behaviors of Sn-9Zn-3Bi-xCr solder in 3.5 wt.% NaCl solution were investigated in this work through potentiodynamic polarization measurements. After electrochemical testing, fracture surfaces were investigated by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and x-ray diffractometry. The results show that adding a small amount of Cr can improve the corrosion resistance of Sn-9Zn-3Bi-xCr solder. The corrosion potential of Sn-9Zn-3Bi solder is -1.251 V. For Sn-9Zn-3Bi-0.5Cr solder, it is -1.200 V. The corrosion potential increased when raising the Cr content, and the Sn-9Zn-3Bi-0.5Cr solder showed the best corrosion resistance. After polarization, a passivation film covered the surface of the Cr-bearing solders. The higher the Cr content, the more compact the passivation film. Long-term aging worsened the corrosion resistance. After 4 days of aging, the corrosion potential of Sn-9Zn-3Bi solder was -1.254 V. After 9 days, it was -1.268 V.

引用

页码：1556 / 1562

页数：7

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