Recovering contacting interfaces in packaging and in semiconductor devices: mechanisms and how to handle them in analysis

被引：0

作者：

Jacob, Peter ^{[1
,2
]}

Pecnik, Christina ^{[1
]}

Nicoletti, Giovanni ^{[1
]}

Broennimann, Rolf ^{[1
]}

机构：

[1] Empa Duebendorf, Ueberlandstr 129, CH-8600 Dubendorf, Switzerland

[2] EM Microelect Marin SA, Rue Sors 2-3, CH-2074 Marin Epagnier, Switzerland

来源：

PROCEEDINGS OF THE 2016 IEEE 23RD INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2016年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Several analysis cases reported contact problems on both device and packaged level. However, they recovered upon the attempt to electrically verify them. Further analysis showed that this recovery can be achieved through extremely low ESD effects. Recovery mechanisms and important precautions will be further discussed in order to avoid sudden disappearance of recoverable opens.

引用

页码：326 / 331

页数：6