Diamond polishing of crystalline materials for optoelectronics

A study of the mechanism of mechanical polishing of optoelectronic components made of crystalline materials has demonstrated that the removal rate in polishing decreases with increasing workpiece material's bond energy and energy of transfer and grows with increasing thermal conductivity coefficient of the workpiece material, sliding distance of a workpiece surface element against the polishing pad surface, and Lifshitz force. The ratio between the volumetric wear coefficient and thermal diffusivity of the workpiece material is shown to depend on specific heat capacity and energy of transfer.