Single-layer miniature broadband microstrip antenna using wirebonding technique

被引:4
|
作者
Dou, W [1 ]
Chia, MYW [1 ]
机构
[1] Natl Univ Singapore, Ctr Wireless Commun, Singapore 117674, Singapore
关键词
Assembly - Bandwidth - Bonding - Chip scale packages - Directional patterns (antenna) - Electric impedance - Miniature instruments;
D O I
10.1049/ip-map:20010494
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A wirebonding technique is presented for designing a single-layer miniature and broadband microstrip antenna on the basis of experiments. The technique most commonly applied in device assembly will support manufacturing and packaging of small antennas by avoiding via-holes. Consisting of three short-circuited elements fed by a parasitic wirebonding configuration, the antenna in a package format has the merits of wide impedance bandwidth, miniature structure, flexible matching and easy integration into RIF front-end units. Its stable and broadside copolarised radiation patterns in the frequency range of 2.40-2.51 GHz are satisfactory for Bluetooth application.
引用
收藏
页码:199 / 202
页数:4
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