Novel EDA Tools for System Planning and 3D Layout Design of Smart Items

被引：0

作者：

Stube, Bernd ^{[1
]}

Schroeder, Bernd ^{[2
]}

Mullins, Thomas ^{[2
]}

Bartels, Tinko ^{[2
]}

Lang, Klaus-Dieter ^{[1
]}

机构：

[1] Fraunhofer Inst Reliabil & Microintegrat IZM, Berlin, Germany

[2] Tech Univ Berlin, Elect Engn & Comp Sci, Berlin, Germany

来源：

2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC) | 2017年

关键词：

EDA Tools; system planning; 3D layout design; smart items; layout algorithm; constraint solving;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper introduces concept and functionalities of two novel electronic design automation EDA Tools for system planning and 3D layout design of smart items. These tool functionalities allow first feasibility decisions and pre-layout analysis in a early design stage. Thus, the quality of the design process can be ensured and expensive re-design can be avoided.

引用

页码：1 / 6

页数：6

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