Reliability Laboratory Analysis of PCB Surface Coating Based on ENEPIG

Electroless palladium are introduced to ENEPIG surface coating technology, from reaction principle to prevent oxidation of nickel-plated, but the process conditions and parameters of practical application are whether or not mass-produce condition, need using a series of reliability experiments to validate it, to reduce risk coefficient of mass-produce, to satisfy customer requirement. Therefore, put forward a package of experimental programs, including experiment projects, experiment methods, instrument and equipment for test, evaluate requirement, test result and analysis etc, especially using TEM have in-depth analysis for interface alloy compound of ENEPIG coating player with SAC305, systematically verified ENEPIG production technology are mature and reliable, it is considered to be versatile surface coating technology, and particularly suitable for application in gold bonding and surface mount hybrid assembly board which are high connecting reliability product, completely replace the current ENIG technology.