Integrated Wideband 2-D and 3-D Transitions for Millimeter-Wave RF Front-Ends

被引:8
|
作者
Rida, Amin [1 ]
Margomenos, Alexandros [2 ]
Lee, Jae Seung [2 ]
Schmalenberg, Paul [2 ]
Nikolaou, Symeon [1 ]
Tentzeris, Manos M. [1 ]
机构
[1] Georgia Inst Technol, Dept Elect Engn, Atlanta, GA 30332 USA
[2] Toyota Res Inst N Amer, Ann Arbor, MI 48105 USA
关键词
2-D transition; 3-D transition; broadband transition; coplanar waveguide (CPW); integration; microstrip; millimeter-wave; ARRAY;
D O I
10.1109/LAWP.2010.2091714
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter reports on broadband 3-D and 2-D transitions on flexible organic liquid crystal polymer (LCP) substrate with return loss below 15 dB for frequencies up to 110 GHz. The presented novel 3-D coplanar waveguide-coplanar waveguide-microstrip (CPW-CPW-MSTRIP) transition features an insertion loss (IL) of 0.45 dB for a 3.3-mm total (longitudinal) length of transition, while the novel 3-D CPW-CPW transition has an IL of 0.25 dB for a 2.8-mm (longitudinal) length of transition. These transitions require strategically placed vias and tapering of the CPW ground planes in order to suppress radiation loss and optimize the performance over a very broad frequency range. This letter also includes a 90 CPW bend that shows a return loss lower than 15 dB up to 100 GHz and an insertion loss of 0.75 dB for a 6.35-mm total length of the transition. All these transitions are simple to realize and are compatible with low-cost substrate fabrication guidelines allowing for the easy integration of ICs in 3-D modules, especially in compact automotive radar applications and beam-steering wideband antenna arrays. An example of the integration of the proposed 3-D transitions with a practical antenna array is presented, and experiments verify the very good performance of the integrated topology up to 100 GHz.
引用
收藏
页码:1080 / 1083
页数:4
相关论文
共 50 条
  • [1] Tunable 3-D MEMS Components for Reconfigurable RF Front-Ends
    Liu, Xiaoguang
    Peroulis, Dimitrios
    2011 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (APSURSI), 2011, : 1123 - 1126
  • [2] InP DHBT MMICs for Millimeter-Wave Front-ends
    Johansen, Tom K.
    Hadziabdic, Dzenan
    Krozer, Viktor
    2009 SBMO/IEEE MTT-S INTERNATIONAL MICROWAVE AND OPTOELECTRONICS CONFERENCE (IMOC 2009), 2009, : 815 - 817
  • [3] Adaptive modeling and design of highly integrated 3D microwave-millimeter wave radio front-ends
    Tentzeris, EM
    GAAS IC SYMPOSIUM - 24TH ANNUAL, TECHNICAL DIGEST 2002, 2002, : 109 - 112
  • [4] A Millimeter-Wave Antenna System for Wideband 2-D Beam Steering
    Baba, Affan Aziz
    Hashmi, Raheel M.
    Esselle, Karu P.
    Attygalle, Manik
    Borg, Daniel
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2020, 68 (05) : 3453 - 3464
  • [5] A Versatile Built-In Test Architecture for Integrated Millimeter-Wave Radar Receiver Front-Ends
    Kissinger, Dietmar
    Agethen, Roman
    Weigel, Robert
    2012 IEEE INTERNATIONAL INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE (I2MTC), 2012, : 254 - 258
  • [6] 3-D Printed Wideband Cassegrain Antenna With a Concave Subreflector for 5G Millimeter-Wave 2-D Multibeam Applications
    Bi, Yingyu
    Li, Yujian
    Wang, Junhong
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2020, 68 (06) : 4362 - 4371
  • [7] Compact and wideband 3-D IPD butler matrix for millimeter-wave communications
    Cayron, Audrey
    Viallon, Christophe
    Ghannam, Ayad
    Magnani, Alessandro
    Parra, Thierry
    AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, 2024, 173
  • [8] A Wideband Millimeter-Wave Circularly Polarized Antenna With 3-D Printed Polarizer
    Wang, Kai Xu
    Wong, Hang
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2017, 65 (03) : 1038 - 1046
  • [9] 3D Packaging Technology for Integrated Antenna Front-Ends
    Bonnet, Barbara
    Monfraix, Philippe
    Chiniard, Renaud
    Chaplain, Jerome
    Drevon, Claude
    Legay, Herve
    Couderc, Pascal
    Cazaux, Jean-Louis
    2008 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, 2008, : 720 - +
  • [10] 3D Packaging Technology for Integrated Antenna Front-Ends
    Bonnet, Barbara
    Monfraix, Philippe
    Chiniard, Renaud
    Chaplain, Jerome
    Drevon, Claude
    Legay, Herve
    Couderc, Pascal
    Cazaux, Jean-Louis
    2008 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2008, : 542 - +