Total Productive Maintenance in a Semiconductor Manufacturing Firm: An Empirical Analysis

被引:0
|
作者
Ng, K. C. [1 ]
Goh, G. G. G. [2 ]
Eze, U. C. [3 ]
机构
[1] Infineon Technol, Melaka, Malaysia
[2] Multimedia Univ, Fac Business, Melaka, Malaysia
[3] Monash Univ Sunway, Sch Business, Subang Jaya, Malaysia
关键词
Total productive maintenance; comparison analysis; secondary data analysis;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Total productive maintenance is claimed to play a key role in improving maintenance and engineering performance in firms. With the use of TPM, manufacturing organizations would be able to reduce wastage and enhance productivity. This study is conducted in a large semiconductor manufacturing firm in Malaysia and analyses the secondary data obtained from the total fabrication monitoring system using paired samples t-test. The results indicate that all the performance measures indicate significant improvements after TPM implementation which lends support to the claim of the effectiveness of TPM. Hence, manufacturing firms need to seriously weigh the pros and cons of TPM implementation and take the necessary steps needed to effectively deploy TPM to enjoy better machine performance rates for increased productivity levels.
引用
收藏
页码:829 / 833
页数:5
相关论文
共 50 条