A Dual-Band Wireless Power Transfer and Backscatter Communication Approach for Implantable Neuroprosthetic Devices

被引：0
|
作者：
Kampianakis, Eleftherios [1 ]
Sharma, Apoorva [1 ]
Arenas, Jose [1 ]
Reynolds, Matthew S. [1 ,2 ]
机构：
[1] Univ Washington, Dept Elect Engn, Seattle, WA 98195 USA
[2] Univ Washington, Dept Comp Sci & Engn, Seattle, WA 98195 USA
来源：
2017 IEEE INTERNATIONAL CONFERENCE ON RFID (RFID) | 2017年
基金：
美国国家科学基金会;
关键词：
TELEMETRY; SYSTEM;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present a dual-band HF and UHF fully-integrated implantable neuroprosthetic testbed. This testbed includes a custom implanted device as well as an external system based on a commercially available USRP B210 software defined radio (SDR) platform. The implanted device integrates a BPSK backscatter uplink rate of 5 Mbps, an HF WPT efficiency of 47% with a power consumption of 1.332 milliwatt. The implanted device measures 25 mm diameter and has a total thickness of 2.8 mm including the printed circuit substrate, antenna, all circuitry, and silicone encapsulation. It supports up to 10 neural and 4 electromyogram (EMG) channels with a sampling rate of 26.1 kHz for the neural channels and 1.628 kHz for the EMG channels. The communication link is shown to have 0% packet error rate at an implant depth of up to 2.5 cm.
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页数：6
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