Effect of interface roughness on fatigue crack growth in Sn-Pb solder joints

被引：34
|
作者：
Shang, JK
Yao, DP
机构：
[1] Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL
来源：
JOURNAL OF ELECTRONIC PACKAGING | 1996年 / 118卷 / 03期
关键词：
D O I：
10.1115/1.2792148
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in 63Sn-37Pb solder joints. Model interfaces with different values of roughness were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology.
引用
收藏
页码：170 / 173
页数：4
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