Membrane-supported Ka band resonator employing organic micromachined packaging

被引：0
|
作者：
Harriss, JE [1 ]
Pearson, LW [1 ]
Wang, X [1 ]
Barron, CH [1 ]
Pham, AV [1 ]
机构：
[1] Clemson Univ, Dept Elect & Comp Engn, Clemson, SC 29634 USA
来源：
2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A scheme for employing organic materials for micromachining of the packaging structure of membrane-supported millimeter wave circuits is described. The format of the packaging follows that devised by Brown, Blondy, and Rebeiz [1,2]. The organic micromachining process employs bulk parts patterned photolithographically from Epon(R) SU-8 photoresist adhered to polyimide membranes. Conducting elements are formed by evaporation of gold, followed by electroplating for thickness build up.
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页码：1225 / 1228
页数：4
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