Cohesive Toughness Of Low-k Film With Periodically Changing Elastic Modulus: Cube-Corner Indentation

被引：0
|
作者：
Yeap, Kong Boon [1 ]
Hangen, Ude [2 ]
Ritz, Yvonne [1 ]
Kim, Taek-Soo [3 ]
Dauskardt, Reinhold [4 ]
Zsehech, Ehrenfried [1 ]
机构：
[1] Fraunhofer Inst Nondestruct Testing IZFP, Maria Reiche Str 2, D-01109 Dresden, Germany
[2] Hysitron Inc, Technol Zentrum Europapl, D-52068 Aachen, Germany
[3] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA
[4] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
来源：
STRESS-INDUCED PHENOMENA IN METALLIZATION | 2010年 / 1300卷
关键词：
low-k dielectric films; UV curing; cohesive toughness; indentation; DIELECTRIC-CONSTANT FILMS; FRACTURE; GLASSES;
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The through-thickness cohesive toughness is estimated by applying the cube-corner indentation method for an organosilicate glass (OSG), cured by monochromatic UV irradiation to obtain oscillating elastic moduli across the film thickness. Radial cracks induced by cube-corner indentation on as-deposited OSG film shows a straight crack path, while the indentation on OSG film with elastic modulus oscillation shows a disturbed crack path. The cohesive toughness increases from (0.059 +/- 0.001) MPa.m(1/2) to (0.063 +/- 0.001) MPa.m(1/2) after monochromatic UV curing.
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页码：159 / +
页数：2
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