Investigation of thermal properties of Al-Si matrix reinforced fine SiCp composites

The characterisation of thermal expansion coefficient and thermal conductivity of Al-Si matrix alloy and Al-Si alloy reinforced with fine SiCp (5 and 20 wt-%) composites fabricated by stir casting process are investigated. The results show that with increasing temperature up to 350 degrees C, thermal expansion of composites increases and slowly reduces when the temperature reaches to 500 degrees C. The values of both thermal expansion and conductivity of composites are less than those for Al-Si matrix. Microstructure and particles/matrix interface properties play an important role in the thermal properties of composites. Thermal properties of composites are strongly dependent on the weight percentage of SiCp.