Development of the next generation 1200V trench-gate FS-IGBT featuring lower EMI noise and lower switching loss

被引:39
|
作者
Onozawa, Y. [1 ]
Nakano, H. [1 ]
Otsuki, M. [1 ]
Yoshikawa, K. [2 ]
Miyasaka, T. [1 ]
Seki, Y. [3 ]
机构
[1] Fuji Elect Device Technol Co Ltd, 4-18-1 Tsukama, Matsumoto, Nagano 3900821, Japan
[2] Fuji Elect Adv Technol Co Ltd, Ichihara, Chiba, Japan
[3] Fuji Elect Holdings Co Ltd, Tokyo, Japan
关键词
floating P-base layer; EMI noise; turn-on di/dt controllability; turn-off oscillation; FWD reverse recovery dv/dt;
D O I
10.1109/ISPSD.2007.4294920
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes the next generation 1200V trench-gate FS-IGBT chip technologies based on the concepts of the "low noise" and "low power dissipation". The novel design of the IGBT surface structure has been able to realize 36% reduction of the turn-on power dissipation when compared to the conventional IGBTs under the operating condition to set the same FWD reverse recovery dv/dt. Furthermore, the trade-off relationship between the on-state voltage and the turn-off power dissipation has been improved about 20% without the turn-off oscillation even in the extreme condition.
引用
收藏
页码:13 / +
页数:2
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