Effect of Coupling Agent on Adhesion of Underfill on Copper

被引：0

作者：

Mitsugi, Hironao ^{[1
]}

Shohji, Ikuo ^{[1
]}

Koyama, Shinji ^{[1
]}

Kitagoh, Shinya ^{[1
]}

机构：

[1] Gunma Univ, Grad Sch Sci & Technol, Kiryu, Gunma 3768515, Japan

来源：

2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2014年

关键词：

underfill; coupling agent; shear strength; copper;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effects of coupling treatment on mechanical properties of UF and adhesion on the Cu plate have been examined using standard UF materials which are composed bisphenol F-type epoxy resin and spheroidal SiO2 filler. As the result, elastic modulus and tensile strength of UF was improved by coupling treatment. Fracture strain was improved at R. T., but was decreased at 80 degrees C and 120 degrees C by coupling treatment. Tensile strength depends on the interfacial state of the matrix resin and fillers. Peeling of fillers from the matrix resin was suppressed by coupling treatment at the temperature under 80 degrees C. Fracture mode of UF with coupling treatment changed from the matrix fracture to the interfacial fracture in the boundary of Tg. Moreover, coupling treatment affects on the relaxation behavior of elastic modulus of UF and makes the relaxation time of storage modulus shift to the longer side. Shear strength of the UF bump bonded on the Cu plate was increased by coupling treatment.

引用

页码：774 / 777

页数：4

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