Capillary underfill and Mold encapsulation materials for exposed die flip chip molded matrix array package with thin substrate

被引：0

作者：

Kooi, CC ^{[1
]}

Shing, LS ^{[1
]}

Periaman, S ^{[1
]}

Chui, J ^{[1
]}

Then, E ^{[1
]}

Huat, NC ^{[1
]}

Fai, LM ^{[1
]}

机构：

[1] Intel Technol M Sdn Bhd, Bayan Lepas FIZ, Bayan Lepas 11900, Penang, Malaysia

来源：

PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2003年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper discusses the work on capillary underfill and mold technology to assemble exposed die backside Flip Chip Molded Matrix Array. Parts were successfully assembled and subjected to reliability stress test. The interaction between capillary underfill and mold compound materials are crucial for assembly and reliability performances of this configuration. Both materials need to be chemically and physically compatible to achieve high reliability performance.

引用

页码：324 / 330

页数：7

共 10 条

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