Investigation on bridge in QFP and fatigue in EGA based on simulating - Solder joints formation

被引：0

作者：

Zhao, XJ ^{[1
]}

Wang, CQ ^{[1
]}

Zhang, L ^{[1
]}

Yin, CY ^{[1
]}

Yang, SQ ^{[1
]}

机构：

[1] Harbin Inst Technol, Natl Lab Adv Welding Technol, Harbin 150001, Peoples R China

来源：

INTELLIGENT SYSTEMS IN DESIGN AND MANUFACTURING III | 2000年 / 4192卷

关键词：

QFP; EGA; bridge; fatigue; simulation; solder joint formation;

D O I：

10.1117/12.403651

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

The application of Quad Flat Pack (QFP) and Ball Grid Array (BGA) technology in manufacturing of advanced electronic products has been grown significantly during past several years. QFP and EGA has several advantages over traditional packaging technology in terms of smaller package area, higher I/Os, higher assembly yield, and so on. However, some potential problems of bridge among solder joints in QFP and creep-fatigue failure of solder joints in EGA in serving occurs and often results in the failure of products. It has been found that both the bridge in QFP and fatigue failure of solder joints in EGA highly depends on the shape of solder joints. So, in this paper, the mathematical models of simulating the formation of solder joints in QFP and EGA are built based on minimum energy theorem, and the shape of solder joints are predicted. According to the predicted shape, the bridge mechanism in solder joints in QFP and the fatigue failure of solder joints in BGA is investigated.

引用

页码：222 / 227

页数：6

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