MORPACK CUBE: A PORTABLE 3D HETEROGENEOUS SYSTEM INTEGRATION PLATFORM

被引：0

作者：

Chiu, Chun-Chieh ^{[1
]}

Lin, Chih-Hsing ^{[1
]}

Yang, Chih-Chyau ^{[1
]}

Liu, Yi-Jun ^{[1
]}

Chen, Ssu-Ying ^{[1
]}

Chue, Jin-Ju ^{[1
]}

Kuo, Chih-Ting ^{[1
]}

Sung, Gang-Neng ^{[1
]}

Lin, Chun-Pin ^{[1
]}

Wu, Chien-Ming ^{[1
]}

Huang, Chun-Ming ^{[1
]}

机构：

[1] Natl Chip Implementat Ctr CIC, Hsinchu, Taiwan

来源：

2013 IEEE 26TH INTERNATIONAL SOC CONFERENCE (SOCC) | 2013年

关键词：

3D Heterogeneous Integrated Platform; MorPACK; Sensor; Bluetooth;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper proposes a portable three-dimensional (3D) heterogeneous system integration platform with reusable sockets, namely, morphing package Cube (MorPACK Cube). The architecture of MorPACK Cube platform achieves the features of miniaturization and portability without a carrier board. Our proposed MorPACK Cube integrates accelerometer sensor, gyroscope sensor and electronic compasses sensor and then exhibits on Andriod platform through Bluetooth wireless communication. Furthermore, we develop an Mobile APP, namely SigView, to display and analysis the collected data from these sensors. The proposed MorPACK Cube is used for sensor applications to demonstrate the effectiveness, compared with the total area 434cm(2) obtained by implementing MorPACK Cube platform with a carrier board, the results show that there are 91.14% area cost reduced by the MorPACK Cube platform without a carrier board. Besides, around 60% performance improvement of operation frequency can be benefited from the 3D-stacking technique.

引用

页码：197 / 202

页数：6

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