Advanced cooling system using miniature heat pipes in mobile PC

被引：9
|
作者：
Nguyen, T [1 ]
Mochizuki, M [1 ]
Mashiko, K [1 ]
Saito, Y [1 ]
Sauciuc, I [1 ]
Boggs, R [1 ]
机构：
[1] Fujikura Ltd, Koto Ku, Tokyo 135, Japan
来源：
ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS | 1998年
关键词：
D O I：
10.1109/ITHERM.1998.689612
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper describes various cooling solutions using heat pipes for cooling of notebook PC. Namely, (1) heat pipe with heat spreader plate. (2) hybrid system - i.e. heat pipe with heat sink and fan. (3) hinged heat pipe system. For heat input of less than 12 watts, the thermal resistance measured between the surface of the CPU to ambient are : > 8 degrees C/W for system (1) and 4 - 6 degrees C/W for systems (2) and (3). This means that the hybrid system and the hinged heat pipe systems are the most suitable candidates for cooling of the current CPU, which may required heat dissipation of more than 8 watts at ambient of 40 degrees C and CPU maximum temperature of 95 degrees C. Experimental results of these three systems are included and discussed in this paper.
引用
收藏
页码：507 / 511
页数：5
相关论文
共 50 条
  • [1] Advanced cooling system using miniature heat pipes in mobile PC
    Nguyen, T
    Mochizuki, M
    Mashiko, K
    Saito, Y
    Sauciuc, I
    Boggs, R
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (01): : 86 - 90
  • [2] An Experimental Study on Applying Miniature Loop Heat Pipes for Laptop PC Cooling
    Lin, Z. R.
    Lin, W. Z.
    Zhang, L. W.
    Wang, S. F.
    2013 TWENTY NINTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2013, : 154 - 158
  • [3] Miniature loop heat pipes for electronics cooling
    Pastukhov, VG
    Maidanik, YF
    Vershinin, CV
    Korukov, MA
    APPLIED THERMAL ENGINEERING, 2003, 23 (09) : 1125 - 1135
  • [4] Miniature loop heat pipes for electronic cooling
    Hoang, TT
    Ku, J
    Butler, CD
    Swanson, TD
    ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 2, 2003, : 517 - 525
  • [5] Miniature heat pipes as compressor cooling devices
    Possamai, F. C.
    Setter, I.
    Vasiliev, L. L.
    APPLIED THERMAL ENGINEERING, 2009, 29 (14-15) : 3218 - 3223
  • [6] Enhancing the cooling of CPU desktop PC by using heat pipes
    Kaseb, S.A. (kaseb@cu.edu.eg), 1600, Cairo University (60):
  • [7] Double-sided IPEM cooling using miniature heat pipes
    Martens, TJ
    Nellis, GF
    Pfotenhauer, JM
    Jahns, TM
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (04): : 852 - 861
  • [8] Low-noise cooling system for PC on the base of loop heat pipes
    Pastukhov, Vladimir G.
    Maydanik, Yury F.
    TWENTY SECOND ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2006, 2006, : 95 - +
  • [9] Low-noise cooling system for PC on the base of loop heat pipes
    Pastukhov, Vladimir G.
    Maydanik, Yury F.
    APPLIED THERMAL ENGINEERING, 2007, 27 (5-6) : 894 - 901
  • [10] Miniature loop heat pipes - A promising means for cooling electronics
    Maydanik, YF
    Vershinin, SV
    Korukov, MA
    Ochterbeck, JM
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (02): : 290 - 296
12345