3D self-assembling of SU-8 microstructures on silicon by plasma induced compressive stress

被引：0
|
作者：
Bureau, JB
Legrand, B
Collard, D
Buchaillot, L
机构：
来源：
Transducers '05, Digest of Technical Papers, Vols 1 and 2 | 2005年
关键词：
SU-8; compressive stress; micro-structuring; self-assemble;
D O I：
暂无
中图分类号：
R318 [生物医学工程];
学科分类号：
0831 ;
摘要：
This paper presents the development of suspended movable microstructures made of SU-8 photoresist where compressive stress leads to 3D self-assembled microstructures. Internal compressive stress in the photoresist is induced by an SF6 based plasma process. Clamped-clamped beam structures have been fabricated to characterize the stress depending on the plasma duration and the lengths of the beams. A compressive stress of 48 MPa was calculated for a 3 minute plasma. X-Ray Photoelectron Spectroscopy (XPS) analysis has been performed to characterize surface of the structures. These mechanical properties could be used to make 3D self-assembled structures for applications in biological sciences.
引用
收藏
页码：19 / 22
页数：4
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