Microstructure and Properties of Graphene/SnO2/Cu-base Composites

Graphene/SnO2 composites were prepared by hydrothermal synthesis to modify the surface of graphene, which were then used to prepare Graphene/SnO2/Cu by powder metallurgy. Then the microstructure and properties of the composites were investigated. The results reveal that SnO2 nano-particles absorbed on the surface of grapheme will not fall off during the process of preparation; instead they can inhibit aggregation of graphene and improve the composites' density, hardness and thermal conductivity. The density of Graphene/SnO2/Cu composites is 91.0%, hardness (HBW) is 1660 MPa, and thermal conductivity is 139 W/ (m.degrees C), which are much higher than those of the Graphene/Cu composites. The bonding of the Graphene/SnO2/Cu composites at the interface is well, with no crack or interfacial reaction. There are three main reasons that lead to the decrease in electrical conductivity of the composites, namely edge dislocation, deformation twin of copper matrix and SnO2 nano-particles on graphene's surface.