Dynamic fracture of piezoelectric solids with defects

被引：3
|
作者：
Mueller, R. [1 ]
Gross, D. [2 ]
Rangelov, T. [3 ]
Dineva, P. [4 ]
机构：
[1] TU Kaiserslautern, Inst Appl Mech, Dept Mech & Proc Engn, D-67663 Kaiserslautern, Germany
[2] Tech Univ Darmstadt, Div Solid Mech, D-64289 Darmstadt, Germany
[3] Bulgarian Acad Sci, Inst Math Informat, BU-1113 Sofia, Bulgaria
[4] Bulgarian Acad Sci, Inst Mech, BU-1113 Sofia, Bulgaria
来源：
11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL BEHAVIOR OF MATERIALS (ICM11) | 2011年 / 10卷
关键词：
piezoelectric solid; anti-plane cracks and holes; SCF/SIF; BIEM; ANTIPLANE SHEAR; CRACKS; SCATTERING; BEHAVIOR;
D O I：
10.1016/j.proeng.2011.04.015
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Aim of this study is to propose, to develop, to validate and to apply in intensive simulations an efficient non-hypersingular traction boundary integral equation method (BIEM) for the solution of anti-plane dynamic problems of piezoelectric solids with cracks or/and holes. The modelling approach is in the frame of continuum mechanics, wave propagation and linear fracture mechanics. The simulations reveal the dependence of the stress concentration factor (SCF) and the stress intensity factor (SIF) on the electromechanical coupling, on the type and characteristics of the dynamic load, on the material parameters and on the geometry of the defects. (C) 2011 Published by Elsevier Ltd. Selection and peer-review under responsibility of ICM11
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页数：6
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