Recent MMW technology development and its military and commercial applications

被引：6
|
作者：
Lau, KF [1 ]
Liu, L [1 ]
Dow, S [1 ]
机构：
[1] TRW Co Inc, S&EG, Redondo Beach, CA 90278 USA
来源：
1998 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM | 1998年
关键词：
D O I：
10.1109/RFIC.1998.682054
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper highlights key recent advances in the infrastructure of Milli-Meter Wave (MMW) technology. They include improved MMIC design methodologies, enhanced HEMT and HBT wafer processes, new on-wafer testing capabilities, automated assembly of MMW Multi-Chip Assemblies (MCAs) and new packaging techniques. It also addresses the implications of these advances in terms of their impact on a wide range of military and commercial systems. The paper concludes with comments on future trends and directions of the MMW technology.
引用
收藏
页码：87 / 90
页数：4
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