The target heating influence on the reactive magnetron sputtering process

被引:13
|
作者
Bondarenko, A. [1 ]
Kolomiytsev, A. [1 ]
Shapovalov, V. [1 ]
机构
[1] St Petersburg State Electrotech Univ LETI, 5 Prof Popov St, St Petersburg 194354, Russia
关键词
MODEL;
D O I
10.1088/1742-6596/729/1/012006
中图分类号
O59 [应用物理学];
学科分类号
摘要
A physicochemical model for the reactive magnetron sputtering of a "hot" target is described in this paper. The system consisting of eight algebraic equations was solved for a tantalum target sputtered in an O-2 environment. It was established that the hysteresis effect disappears with the increase of the ion current density.
引用
收藏
页数:3
相关论文
共 50 条
  • [1] Target heating in sputtering unit of magnetron
    Kozin, A. A.
    25TH INTERNATIONAL CONFERENCE ON VACUUM TECHNIQUE AND TECHNOLOGY, 2018, 387
  • [2] Influence of the target temperature on a reactive sputtering process
    Billard, A
    Mercs, D
    Perry, F
    Frantz, C
    SURFACE & COATINGS TECHNOLOGY, 1999, 116 : 721 - 726
  • [4] Instability of the reactive magnetron sputtering process
    J. Appl. Spectrosc., 6 (901-904):
  • [5] System of stabilization of reactive magnetron sputtering process
    Burmakou, A. P.
    Kuleshov, V. N.
    Stoliarov, A. V.
    DEVICES AND METHODS OF MEASUREMENTS, 2018, 9 (02): : 114 - 120
  • [6] Controllability Analysis of Reactive Magnetron Sputtering Process
    Ahmad, Z.
    Abdallah, B.
    ACTA PHYSICA POLONICA A, 2013, 123 (01) : 3 - 6
  • [7] Influence of process parameters on the substrate heating in direct current plasma magnetron sputtering deposition process
    Krishnasamy, Jegenathan
    Chan, Kah-Yoong
    Tou, Teck-Yong
    MICROELECTRONICS INTERNATIONAL, 2010, 27 (02) : 75 - 78
  • [8] Target poisoning during reactive magnetron sputtering: Part II: the influence of chemisorption and gettering
    Depla, D
    De Gryse, R
    SURFACE & COATINGS TECHNOLOGY, 2004, 183 (2-3): : 190 - 195
  • [9] The influence of the target age on laterally resolved ion distributions in reactive planar magnetron sputtering
    Welzel, Thomas
    Ellmer, Klaus
    SURFACE & COATINGS TECHNOLOGY, 2011, 205 : S294 - S298
  • [10] Target poisoning during reactive magnetron sputtering: Part I: the influence of ion implantation
    Depla, D
    De Gryse, R
    SURFACE & COATINGS TECHNOLOGY, 2004, 183 (2-3): : 184 - 189