Materials challenges in interconnection: Trade-offs for rapid deployment

被引：0
|
作者：
Frutschy, K [1 ]
Fu, ZZ [1 ]
Goyal, D [1 ]
Kinsman, K [1 ]
Samuelson, G [1 ]
Vogt, R [1 ]
机构：
[1] Intel Corp, Santa Clara, CA 95051 USA
来源：
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 1999年 / 51卷 / 03期
关键词：
Print Circuit Board; Solder Ball; Solder Interconnection; Intel Corporation; Solder Mask;
D O I：
10.1007/s11837-999-0022-x
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This article addresses the subtle changes necessary to achieve a margin against an intrinsic failure mechanism in a highly time-constrained development would. The problem of a coefficient of thermal expansion mismatch between a liquid crystal polymer connector and a FR4 substrate was exacerbated by the size, dimensions, and ball-grid array attachment for such a connector. By carefully controlling the solder-mask wall profile, opening, and overhang, if was possible to avoid the time- and resource-consuming option of changing the connector materials.
引用
收藏
页码：19 / 21
页数：3
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