Mission Profile Analysis and Calorimetric Loss Measurement of a SiC Hybrid Module for Main Inverter Application of Electric Vehicles

被引：0
|
作者：
Pai, Ajay Poonjal [1 ]
Reiter, Tomas [1 ]
Maerz, Martin [2 ]
机构：
[1] Infineon Technol AG, Neubiberg, Germany
[2] Fraunhofer Inst Integrated Syst & Device Technol, Erlangen, Germany
来源：
2017 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper evaluates the benefits of replacing the Si diodes of a commercial IGBT module for the main inverter application of an electric vehicle with SiC diodes, leaving the other components of the package and the system unchanged. This will give a direct comparison of Si vs SiC diodes, without giving scope for discrepancies arising out of differences in the packaging, gate-driver circuit etc. The IGBT-module chosen for comparison is a low inductance (8nH) HybridPACK Drive module from Infineon, suitable for high speed switching. A loss model is developed for the modules, and the resulting model is used to investigate the performance for various drive cycles (Artemis, WLTP, NEDC). A calorimetric loss measurement setup is developed for experimental verification of the results.
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页数：5
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