Wafer level flip chip packaging

被引：0
|
作者：
Tong, QK [1 ]
Ma, B [1 ]
Savoca, A [1 ]
机构：
[1] Natl Starch & Chem Co, Bridgewater, NJ 08807 USA
来源：
MICRO MATERIALS, PROCEEDINGS | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：244 / 244
页数：1
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