Electrically conducting polyaniline/epoxy blend

Polyaniline (PANI) was synthesized by the conventional route. Curing of epoxy resin was attempted by using PANI and combination of maleic anhydride (MAn) and PANI respectively. The materials were characterized by FTIR spectroscopy. Dynamic and isothermal curing was performed by a differential scanning calorimeter (DSC) to find out the enthalpy of curing, activation energy, cure time and conversion rate. Dynamic mechanical thermal analysis (DMTA) was used to find out the effect of PANI on storage modulus and tan delta values of the cured films. Electrical conductivity was measured by the four probe method.