Numerical study of ductile failure morphology in solder joints under fast loading conditions

A numerical study is undertaken to investigate solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model is incorporated into the rate-dependent elastic-viscoplastic response of the tin (Sn)-silver (Ag)-copper (Cu) solder alloy, resulting in the capability of simulating damage evolution leading to eventual failure through crack formation. Attention is devoted to deformation under relative high strain rates (1-100 s(-1)), mimicking those frequently encountered in drop and impact loading of the solder points. The effects of applied strain rate and loading mode on the overall ductility and failure pattern are specifically investigated. It is found that, under shear loading, the solder joint can actually become more ductile as the applied strain rate increases, which is due to the alteration of the crack path. Failure of the solder is very sensitive to the deformation mode, with a superimposed tension or compression on shear easily changing the crack path and tending to reduce the solder joint ductility. (C) 2010 Elsevier Ltd. All rights reserved.