Applications of Soft Defect Localization (SDL) on AMD Advanced SOI Microprocessors

被引：0
|
作者：
Seah, Yi-Xuan [1 ]
Palaniappan, M. [1 ]
Chin, J. M. [1 ]
机构：
[1] Adv Micro Devices S Pte Ltd, Singapore 469032, Singapore
来源：
ISTFA 2006 | 2006年
关键词：
D O I：
暂无
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
In this paper, we present application of the SDL technique towards full root cause analysis of functional and structural failures from BIST, SCAN etc. on AMD's advanced Silicon-on-Insulator (SOI) microprocessors based on a 90 nm process technology node. The devices were exercised at speed using production testers. SDL is used on these microprocessors with failure modes which pass at a lower temperature/voltage but fail at higher temperature/voltage or vice versa to isolate the failing logic/node. The SDL sites arc examined for a fiat root cause analysis and possible process improvements
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页码：311 / 315
页数：5
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