Study of material removal behavior on R-plane of sapphire during ultra-precision machining based on modified slip-fracture model

被引:13
|
作者
Kwon, Suk Bum [1 ]
Nagaraj, Aditya [1 ]
Yoon, Hae-Sung [2 ]
Min, Sangkee [1 ]
机构
[1] Univ Wisconsin, Dept Mech Engn, Room 1039,1513 Univ Ave, Madison, WI 53706 USA
[2] Korea Aerosp Univ, Sch Aerosp & Mech Engn, 76 Hanggongdaehak Ro, Goyang Si 10540, Gyeonggi Do, South Korea
关键词
Ductile-brittle transition; Crack morphology; Single crystal sapphire; Deformation mechanism; Orthogonal cutting; Ultra-precision machining; BRITTLE-DUCTILE TRANSITION; UNDEFORMED CHIP THICKNESS; MECHANISMS; SILICON;
D O I
10.1016/j.npe.2020.07.001
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this paper, the modified slip/fracture activation model has been used in order to understand the mechanism of ductile-brittle transition on the R-plane of sapphire during ultra-precision machining by reflecting direction of resultant force. Anisotropic characteristics of crack morphology and ductility of machining depending on cutting direction were explained in detail with modified fracture cleavage and plastic deformation parameters. Through the analysis, it was concluded that crack morphologies were mainly determined by the interaction of multiple fracture systems activated while, critical depth of cut was determined by the dominant plastic deformation parameter. In addition to this, by using proportionality relationship between magnitude of resultant force and depth of cut in the ductile region, an empirical model for critical depth of cut was developed. Copyright (C) 2020 Tianjin University. Publishing Service by Elsevier B.V. on behalf of KeAi Communications Co., Ltd.
引用
收藏
页码:141 / 155
页数:15
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