Strategies to reduce bond-line read-out in adhesive joined SMC automotive body panels

被引：1

作者：

Basu, Soumendra K. ^{[1
]}

Kia, Hamid G. ^{[2
]}

机构：

[1] Gen Motors R&D, ITPL, India Sci Lab, Bangalore 560066, Karnataka, India

[2] Gen Motors R&D, Mat & Proc Lab, Warren, MI 48090 USA

来源：

JOURNAL OF COMPOSITE MATERIALS | 2008年 / 42卷 / 17期

关键词：

bond line read through; class-A surface; residual stress; deformation; sheet molding compound (SMC); adhesive bonding; parameter sensitivity;

D O I：

10.1177/0021998308094541

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

Parameter sensitivity analysis on a 2D finite element model of adhesive-joined SMC hat/plate structure was performed to evaluate the relative impact of design, application, and material parameters on the bond-line read-out (BLRO) defect. Based on the sensitivity analysis and the ease of implementation, a list of strategies in the order of their effectiveness in reducing the BLRO defect is proposed. Choosing a low modulus, low cure temperature, and low shrinkage adhesive, raising the stiffness of the exterior SMC panel, and lowering the stiffness of the interior SMC panel in the regions around the bond-line were found to reduce the BLRO defect.

引用

页码：1801 / 1815

页数：15