High-power surface-mount package holds RF ICs

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作者：

Chin, S

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来源：

ELECTRONIC PRODUCTS MAGAZINE | 1996年 / 39卷 / 06期

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中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

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页码：21 / 22

页数：2

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