A Survey on Recent Advances of Medium Voltage Silicon Carbide Power Devices

被引:0
|
作者
Hu, Boxue [1 ]
Lyu, Xintong [1 ]
Xing, Diang [1 ]
Ma, Dihao [1 ]
Brothers, John [1 ]
Na, Risha [1 ]
Wang, Jin [1 ]
机构
[1] Ohio State Univ, Ctr High Performance Power Elect, Columbus, OH 43210 USA
关键词
Silicon Carbide (SiC); medium voltage; high voltage; semiconductor device; packaging; gate drive;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Medium voltage (MV) Silicon Carbide (SiC) power devices have become available as engineering samples. Recent studies show that they outperform their Silicon (Si) counterparts regarding voltage blocking capability, specific on-state resistance, switching speed and maximum allowable junction temperature. It is projected that MV SiC power devices will bring revolutionary changes in medium and high voltage applications such as traction drives for locomotives, industrial motor drives, utility power transmission systems, etc. This paper presents a summary of recent advances in MV SiC power devices, including MOSFETs, IGBTs, GTOs and super-cascode devices. Technical challenges of their applications such as device packaging, gate drive design and gate drive auxiliary power supply design are discussed. Testing results of three state-of-the-art MV SiC devices, including a 4 kV, 5 A discrete SiC MOSFET, a 4.5 kV, 40 A SiC super-cascode device and a 10 kV, 40 A SiC MOSFET power module, are presented as examples.
引用
收藏
页码:2420 / 2427
页数:8
相关论文
共 50 条
  • [1] Recent Advances in Silicon Carbide MOSFET Power Devices
    Stevanovic, Ljubisa D.
    Matocha, Kevin S.
    Losee, Peter A.
    Glaser, John S.
    Nasadoski, Jeffrey J.
    Arthur, Stephen D.
    2010 TWENTY-FIFTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2010, : 401 - 407
  • [2] Recent Advances in High-Voltage, High-Frequency Silicon-Carbide Power Devices
    Hefner, Allen
    Ryu, Sei-Hyung
    Hull, Brett
    Berning, David
    Hood, Colleen
    Ortiz-Rodriguez, Jose M.
    Rivera-Lopez, Angel
    Duong, Tam
    Akuffo, Adwoa
    Hernandez-Mora, Madelaine
    CONFERENCE RECORD OF THE 2006 IEEE INDUSTRY APPLICATIONS CONFERENCE, FORTY-FIRST IAS ANNUAL MEETING, VOL 1-5, 2006, : 330 - 337
  • [3] A Recent Review on Silicon Carbide Power Devices Technologies
    Sheng K.
    Ren N.
    Xu H.
    Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2020, 40 (06): : 1741 - 1752
  • [4] A Gate Driver Design for Medium Voltage Silicon Carbide Power Devices with High dv/dt
    Anurag, Anup
    Acharya, Sayan
    Gohil, Ghanshyamsinh
    Bhattacharya, Subhashish
    IECON 2018 - 44TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY, 2018, : 877 - 882
  • [5] Silicon carbide crystal and substrate technology:: A survey of recent advances
    Hobgood, HM
    Brady, MF
    Calus, MR
    Jenny, JR
    Leonard, RT
    Malta, DP
    Müller, SG
    Powell, AR
    Tsvetkov, VF
    Glass, RC
    Carter, CH
    SILICON CARBIDE AND RELATED MATERIALS 2003, PTS 1 AND 2, 2004, 457-460 : 3 - 7
  • [6] Recent advances in high-voltage SiC power devices
    Chow, TP
    Ramungul, N
    Ghezzo, M
    1998 HIGH-TEMPERATURE ELECTRONIC MATERIALS, DEVICES AND SENSORS CONFERENCE, 1998, : 55 - 67
  • [7] High voltage silicon carbide devices
    Baliga, BJ
    WIDE-BANDGAP SEMICONDUCTORS FOR HIGH POWER, HIGH FREQUENCY AND HIGH TEMPERATURE, 1998, 512 : 77 - 88
  • [8] Silicon carbide for power devices
    Palmour, JW
    Singh, R
    Glass, RC
    Kordina, O
    Carter, CH
    ISPSD '97: 1997 IEEE INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS, 1997, : 25 - 32
  • [9] Medium Voltage Power Switch in Silicon Carbide-A Comparative Study
    Trochimiuk, Przemyslaw
    Kopacz, Rafal
    Frac, Krzysztof
    Rabkowski, Jacek
    IEEE ACCESS, 2022, 10 : 26849 - 26858
  • [10] High Frequency High Voltage Power Conversion with Silicon Carbide Power Semiconductor Devices
    Mao, Saijun
    Wu, Tao
    Lu, Xi
    Popovic, Jelena
    Ferreira, Jan Abraham
    2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2016,