Curing behavior of wood adhesives under high steam pressure

Steam-injection pressing is a recent development for manufacturing wood products. The curing mechanism and behavior of wood adhesives during steam-injection heating and hot-platen heating may cause differences in both chemical and physical aspects. The curing of wood adhesives under high steam pressure using an especially designed reaction cell is discussed. The adhesives used in this study were phenol-formaldehyde (PF), urea-formaldehyde (UF), melamine-formaldehyde (MF), and isocyanate (IC) resins. At different curing times, the heating temperature (steam pressure) applied to cure the adhesives was 160 degreesC (6 kgf/cm(2)). Results were examined by analytical methods using FR-IR, C-13-NMR, dynamic mechanical analysis and solvent extraction. (1) By steam-injection heating, PF resin immediately cured to some degree in a few minutes and maintained an equilibrium situation. In this case, the reaction was accompanied by the disappearance of the ether structure. (2) In OF resin, results from IR data clarified different reactions between hot-platen heating and steam-injection heating. During steam-injection heating, as heating time increased, OF resin returned to its liquid state under the influence of hydrolysis. (3) MF resin was almost cured under steam-injection in a short heating time compared with hot-platen heating. (4) IC resin foamed and cured in a short heating time under steam-injection. It was proved that steam-injection heating was more effective than by hot-platen heating for IC resin.