Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with Sn-3.5Ag-8In-0.5Bi Solder in 30°C60%RH

被引：0

作者：

Saito, Akira ^{[1
,2
]}

Nishikawa, Hiroshi ^{[3
]}

机构：

[1] Murata Mfg Co Ltd, Nagaokakyo, Kyoto, Japan

[2] Osaka Univ, Grad Sch Engn, Osaka, Japan

[3] Osaka Univ, Joining & Welding Res Inst, Osaka, Japan

来源：

2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC) | 2019年

关键词：

Tin whisker; Indium; Low-temperature soldering; Termination; MLCC;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Low-temperature soldering using Sn-3.5Ag-81n-0.5Bi solder, Sn-8A-3Bi solder, 42Sn-58Bi eutectic solder cause the tin whisker growth 011 the tin plating in the testing.* tin whisker..Especially, the tin whisker 011 the tin plating of MLCC (multi -layer ceramic capacitor) mounted by Sn-3.5,4g-8111-0.5Bi solder grew up fast, and its length became 160 um at 8000 h in 30 C.60%Rfl. But the mechanism of the whisker growth was unknown. We suggest a new mechanism of whisker growth related to the shape of ternmination and reflow temperature.

引用

页数：4